Rev B Changes, before and after production

Rev B Evolutionary Changes

Rev B Changes, included in the Rev B Schematic with its corresponding netlist (for pads), and bill of materials (and bom spreadsheet)

1) change R63 to open circuit, Change C40 (from JP3 to U13-2) to R119 = 4.7K.
2) R66 & R68 pads to 1210 size.
3) Suggest change 1uF Capacitors, C18, C23, C24, C27, C36, C38, C44, C45, C50, C58, C61, C63, C65, C67, C68, C72 and C74, to X7R Ceramic (DC020703FIF) 0805 size
4) R26, R27, R32 to 511ohm 0805.
5) S1 connect only to pin 1, pin2, the switch contacts.
6) Change regulator, U2, to National Semiconductor LP3964 EMP-3.3 (suggest digi-key LP3964EMP-3.3CT-ND)
7) Add fuses F1, F2, F3
8) Add provisional loading instructions to build instructions to loading house.
9) Change Y1 footprint. Three of 5 pads out of position.
10) Add four protective diodes, D9, D10, D11 and D12.
11) Add ground pins on JP3 (RJ45 input connector)
12) Add ground pins on JP2A and JP2B
13) Change DS1, DS2, DS3 to a three-in-one verticle LED unit DS1a,b,c, (suggest digi-key 350-1274-ND)
14) Add feature that allows a modem control line to be used to generate reset pulse in manual mode.
15) Revise end panel layout to accommodate LED change. Allow for access to S1 from rear panel.
16) Shorten board by 1/16" (?)